400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
The 400 Tie Points Half Size Solderless Breadboard is a versatile and user-friendly tool for prototyping and testing your electronic circuits. This high-quality breadboard offers a secure and efficient platform for connecting components without...
SKU: B411,krt111,IMP1000,Th500
Product details
The 400 Tie Points Half Size Solderless Breadboard is a versatile and user-friendly tool for prototyping and testing your electronic circuits. This high-quality breadboard offers a secure and efficient platform for connecting components without the need for soldering. Key Features: Versatile Design: 400 Tie Points Accommodates a wide range of components and circuits. Solderless Connection: Easily connect and disconnect components without soldering. Power Lanes: Provides dedicated power supply connections for convenience. Durable Construction: Built to last with high-quality materials. Compact Size: Ideal for various projects and workspace setups. Specifications: Tie Points: 400 Power Lanes: 100 Dimensions: 82mm x 55mm x 10mm Maximum Voltage: 300V Maximum Operating Current: 3-5A Allowed Wire Size: 29-20 AWG Order Now: Streamline your prototyping process with our 400 Tie Points Half Size Solderless Breadboard. Experience the versatility and convenience of this essential tool.
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